Join Books.org — it's free

Mechanical Engineering - General & Miscellaneous, Electronics - Microelectronics
Advanced MEMS Packaging by John H. Lau β€” book cover

Advanced MEMS Packaging

by John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin
Write a review
Log in to track your reading progress.

This is the only edition we have for Advanced MEMS Packaging.