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Overview
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Synopsis
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Booknews
Chapters by various experts provide a reference for design, materials, processes, equipment, manufacturing, quality, reliability, packaging, and system engineers and technical managers. Topics include wire bonding, TAB, flip COB, testing, wafer bumping and inner lead bonding, solder bumped flip chips, chip attachments, wire bonding chip and TAB chip on board, micro bump bonding chips, chip on board encapsulation, and underfill encapsulation for flip chips. All those chips and no salsa. Annotation c. Book News, Inc., Portland, OR (booknews.com)