Electronics - Circuits - VLSI, Electronics - Microelectronics
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Overview
The electronics industry is abuzz with talk of flip chip technologies (FCT),the group of revolutionary new techniques that enable chips to be connected to substrates without the use of wires. By literally placing the chip upside down and in direct contact with the substrate,FCT is a highly efficient—and increasingly popular—alternative to traditional bonding techniques. This is the first book to cover all of the major design,materials,and manufacturing issues related to FCT. Featuring authoritative contributions from the world's leading experts,this volume provides in depth discussion of all five contact points.Editorials
Booknews
A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation c. Book News, Inc., Portland, OR (booknews.com)Book Details
Published
December 1, 1995
Publisher
McGraw-Hill Publishing Co.
Pages
560
Format
Hardcover
ISBN
9780070366091