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Overview
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors.
Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science.
Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.
Audience: Professionals and advanced graduate students working in electronic materials and packaging.
Synopsis
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.
The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.
Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors.
Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science.
Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems.
Booknews
Government and academic researchers present 16 self-contained tutorial chapters that examine all aspects of electronic packaging from a materials perspective, a shadowy area to most workers in the field whose education is in electrical engineering. They consider the packaging of integrated circuit chips; the interconnections for signal transmission, power, and ground; the encapsulations for protecting the chips and interconnections from moisture, chlorides, and other environmental factors; the heat sinks or other cooling devices needed to remove heat from the chips; the power supply; and the housing for electromagnetic interference shielding. Composites, metal films, polymers, and other materials are described, along with processes for joining and materials testing. Annotation c. Book News, Inc., Portland, OR (booknews.com)