Engineering - General & Miscellaneous, Construction & Building Trades, Construction & Building Trades, Engineering - General & Miscellaneous
Available on Bookshop
Write a review
Books.org participates in affiliate programs including Bookshop.org and the Amazon Services LLC Associates Program. We may earn a commission from qualifying purchases made through links on this page, at no additional cost to you.
Log in to track your reading progress.
Editorials
Booknews
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation c. Book News, Inc., Portland, OR (booknews.com)Book Details
Published
December 1, 2009
Publisher
Springer-Verlag New York, LLC
Pages
200
Format
Hardcover
ISBN
9780442002602