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Overview
Colloidal processing has always been a major processing method. It facilitates control of particle interactions through a wide variety of schemes, which include surface coating, dispersion additives, and solvent control, among others. Controlling particle interactions also permits better resultant rheology and controlled green microstructures via a wide range of forming methods. In recent years, the particle size involved has been broadened into both the nanometer and the larger than micrometer ranges. This book covers fundamental issues encountered in colloidal processing nano-(less than 0.1 micron), micro-(from 0.1 to 5 micron) and macro-(larger than 5 micron) particulate systems and at the same time explore applications for these developments.
Synopsis
Papers from an April 2003 symposium summarize recent developments in colloidal ceramic processing and cover a broad range of subjects, including nano-, micro-, and macro-particulate systems. Some subjects examined are aqueous processing of WC-Co powders, colloidal processing of SiC with 700 MPa of flexural strength, adsorption of poly(acrylic acid) on commercial ball clay, analysis of thickness control variables in tape casting, and dispersability of nanometer-sized ceria particles. Other subjects are micromechanical testing of two- dimensional aggregated colloids, rheology of ceramic slurries for electro-deposition in rapid prototyping applications, and analysis of action mechanisms of anionic polymer dispersant. Annotation ©2004 Book News, Inc., Portland, OR