Electronic Assembly Fabrication

* Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition

* Non-specialists guide to assembly fabrication—no advance degrees or math background necessary

* Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition

* Non-specialists guide to assembly fabrication—no advance degrees or math background necessary

CHARLES A. HARPER is the President of Technology Seminars, Inc., an organization which provides educational training courses in electronic packaging and manufacturing to business and industry. He also had an earlier esteemed career with Westinghouse in this field. Widely recognized as one of the leaders in this industry, he has authored over a dozen highly respected books and is among the founders and past presidents of the International Microelectronics and Packaging Society (IMAPS). He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series, a widely used book series in the electronics industry. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he has also served as Adjunct Professor.