Electronic Packaging, Microwave Technology, Electronics - Microelectronics
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Overview
With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayOs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouOll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing.Editorials
Booknews
A guide to design and packaging of high speed digital and microwave circuitry. Early chapters cover the physical properties of packaging, with emphasis on materials properties and assembly technology, and later chapters deal with high speed signal distribution from the perspective of digital transmission lines. Coverage includes signal behavior in high speed circuits, materials selection, manufacturing aspects, design verification, and performance evaluation, with a minimum of mathematics. Includes a glossary. Annotation c. by Book News, Inc., Portland, Or.Book Details
Published
July 1, 1997
Publisher
McGraw-Hill Publishing Co.
Pages
345
Format
Hardcover
ISBN
9780070359703