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Electrothermal Analysis of VLSI Systems by Yi-Kan Cheng β€” book cover

Electrothermal Analysis of VLSI Systems

by Yi-Kan Cheng, Chin-Chi Teng, Ching-Han Tsai
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Overview

This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

Synopsis

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

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Book Details

Published
October 1, 2007
Publisher
Springer-Verlag New York, LLC
Pages
240
Format
Hardcover
ISBN
9780792378617

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