Electronics - Circuits - Integrated, Electronic Packaging, Electronics - Microelectronics
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Michael G. Pecht
Available on Bookshop
Write a review
Books.org participates in affiliate programs including Bookshop.org and the Amazon Services LLC Associates Program. We may earn a commission from qualifying purchases made through links on this page, at no additional cost to you.
Log in to track your reading progress.
This is the only edition we have for Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability.