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Mathematical Modeling - Engineering & Technology, Metallurgy, Materials Science - General & Miscellaneous, Electronics - Microelectronics, Electronics - Semiconductors, Solid State Physics - General & Miscellaneous
Modeling And Simulation Of Microstructure Evolution In Solidifying Alloys by Laurentiu Nastac β€” book cover

Modeling And Simulation Of Microstructure Evolution In Solidifying Alloys

by Laurentiu Nastac
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Overview

The aim of Modeling and Simulation of Microstructure Evolution in Solidifying Alloys is to describe in a clear mathematical language the physics of the solidification structure evolution of cast alloys. The concepts and methodologies presented here for the net-shaped casting and the ingot remelt processes can be applied, with some modifications, to model other solidification processes such as welding and deposition processes.
Another aim of the book is to provide simulation examples of the solidification structure modeling in some crucial commercial casting technologies as well as to provide practical techniques for controlling the structure formation during the solidification processes.

Synopsis

The aim of Modeling and Simulation of Microstructure Evolution in Solidifying Alloys is to describe in a clear mathematical language the physics of the solidification structure evolution of cast alloys. The concepts and methodologies presented here for the net-shaped casting and the ingot remelt processes can be applied, with some modifications, to model other solidification processes such as welding and deposition processes.
Another aim of the book is to provide simulation examples of the solidification structure modeling in some crucial commercial casting technologies as well as to provide practical techniques for controlling the structure formation during the solidification processes.
The simulation codes (PC versions) for 2D (includes fluid flow computations) and 3D mesoscale dendrite growth models (for 2D and 3D simple casting geometries) written in Visual Fortran 90 are provided in a CD attached to the book.

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Book Details

Published
December 1, 2009
Publisher
Springer-Verlag New York, LLC
Pages
304
Format
Hardcover
ISBN
9781402078316

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