Electronic Packaging, Electronics - Microelectronics
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Editorials
Booknews
Introduces multichip modules (MCM), tape automated bonding (TAB), and chip-on-board (COB) design, demonstrating how these methods are capable of producing results that are significantly lighter, smaller, and cheaper than conventional packaging methods. Covers design and manufacturing issues, as well as end-product applications. Illustrated with black and white photos and drawings. Annotation c. Book News, Inc., Portland, OR (booknews.com)Book Details
Published
March 1, 1994
Publisher
McGraw-Hill Inc.,US
Pages
290
Format
Hardcover
ISBN
9780070235526