Engineering - Industrial, Electronics - Circuits - VLSI, Electronics - Circuits - General
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An illustrated guide to manufacturing submicron devices that need multiple levels of interconnects, in high volume with high yields. The author covers the stages of submicron semiconductor device design, process development, manufacturing, assembly, reliability, and marketing. Interconnect design rules and requirements, process integration with considerations of flow definition and material requirements, issues of defect reduction and yield enhancement, and reliability implications are covered. Annotation c. Book News, Inc., Portland, OR (booknews.com)Book Details
Published
August 1, 1993
Publisher
McGraw-Hill Inc.,US
Pages
224
Format
Hardcover
ISBN
9780070512245