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Overview
Barnat (Sandia National Laboratories) and Lu (Rensselaer Polytechnic Institute) present basic knowledge on the design of instrumentation for pulsed and pulsed bias sputtering techniques and on the control of thin film properties using deposition parameters. The transient charging characteristics of the target in the DC reactive sputtering of insulator films and of the insulating substrate in the DC sputtering of metal films without pulsing are discussed in detail. Predictions and experimentation of discharging strategies using pulsing potentials are presented, and examples are given on the growth of thin films using these strategies. The book is of interest to those working in sputter coating of high quality metal and insulating films. Annotation Β©2003 Book News, Inc., Portland, ORSynopsis
Barnat (Sandia National Laboratories) and Lu (Rensselaer Polytechnic Institute) present basic knowledge on the design of instrumentation for pulsed and pulsed bias sputtering techniques and on the control of thin film properties using deposition parameters. The transient charging characteristics of the target in the DC reactive sputtering of insulator films and of the insulating substrate in the DC sputtering of metal films without pulsing are discussed in detail. Predictions and experimentation of discharging strategies using pulsing potentials are presented, and examples are given on the growth of thin films using these strategies. The book is of interest to those working in sputter coating of high quality metal and insulating films. Annotation ©2003 Book News, Inc., Portland, OR