Electronic Packaging, Electronics - Microelectronics
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Overview
The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed,tested,and manufactured. This new,still evolving technology for packaging printed circuit boards (PCBs) is commanding intense interest and excitement. Now one of its pioneers has written the first book that not only describes MCM technology,but also shows designers how to use it in practice. This groundbreaking,hands-on guide covers such practical issues as electronics testing,rework procedures,and failure modes and mechanisms.Editorials
Booknews
A guide to using multichip modules (MCMs) in the design, testing, and manufacture of electronic systems and equipment, for students and professionals in electronics, computer, and materials engineering. Describes how MCMs work, and offers information on characteristics and applications of MCMs, including comparisons with other packaging approaches. Covers substrate designs and processes, thermal management, and rework and repair. Includes appendices of conversion factors and abbreviations, and b&w photos and diagrams. Annotation c. Book News, Inc., Portland, OR (booknews.com)Book Details
Published
October 1, 1994
Publisher
McGraw-Hill Inc.,US
Pages
381
Format
Hardcover
ISBN
9780070377158