Materials Science - General & Miscellaneous, Electronics - Circuits - Integrated, Electronic Packaging, Electronics - General & Miscellaneous
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Overview
Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models.Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Book Details
Published
October 7, 1993
Publisher
Butterworth-Heinemann Ltd
Pages
274
Format
Hardcover
ISBN
9780750692670