Mechanical Engineering - General & Miscellaneous, Electromagnetism - Electricity, Technology - General & Miscellaneous, Electronics - Circuits - VLSI, Electronics - Microelectronics, Electronics - Semiconductors, Solid State Physics - General & Miscellane
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Overview
The bonding of silicon wafers with a silicon dioxide insulating layer between them (an SOI, or "silicon on insulator", technique) permits considerable improvements in the performance of microelectronic circuits produced by very large scale integration (VLSI) and is an enabling technology in the rapidly growing field of microelectromechanical systems (MEMS). The technique has now reached the stage where it is ready to be applied in practice. Engineers engaged in the development of volume production systems employing wafer bonding are in need of guidance from experts in the industry who have been pioneering the technique - the book is designed for this purpose. Applications in CMOS, photonics, optoelectronics and MEMS are discussed. It is liberally illustrated, fully indexed and in "easy-to-absorb" format.Synopsis
This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation c. Book News, Inc., Portland, OR
Book Details
Published
December 1, 2001
Publisher
Institution of Engineering and Technology (IET)
Pages
149
Format
Hardcover
ISBN
9780852960394