Electronic Packaging, Electronics - Semiconductors
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Overview
The wire bonding bible - now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest - and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman's classic Wire Bonding inMicroelectronics shows you step-by-step how to exploit new higherm density interconnection techniques and engineer reliable gonds at a very high yield. You get the hands-on guidance you need to test wire bonds...clean bond pads to improve bondability and realiability...solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems....bond wires to multichipmodules...and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.Editorials
Booknews
Broadened and updated from the 1989 . Part of the new material is more elementary, but in general readers are still expected to have some experience in wire bonding, device packaging, and/or hybrid/ multi-chip module circuit assembly technology. The primary focus is failure mechanisms and yield problems originating from chip-to-package wire bonds, but other wire bonds are also considered. Annotation c. by Book News, Inc., Portland, Or.Book Details
Published
September 1, 1997
Publisher
McGraw-Hill Professional
Pages
290
Format
Hardcover
ISBN
9780070326194