Thermal Stress and Strain in Microelectronics Packaging

Booknews

Covers the foundation and practical applications of thermal stress management, relating relates theory to device-specific solutions for each package element and providing decision criteria for materials selections and geometry optimization. Includes guidelines on how to find thermal stresses and strains by thermomechanical methods, and how to change the materials and geometry of interconnect systems to achieve improvements in cost, performance, quality, size, and weight. Annotation c. Book News, Inc., Portland, OR (booknews.com)